Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132017 | Method of soldering a semiconductor chip to a chip carrier | Michael Stadler | 2024-10-29 |
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Theng Chao Long, Josef Maerz, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |