Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150236 | Voltage regulator module with inductor-cooled power stage | Gerald Deboy, Kok Yau Chua, Angela Kessler, Kennith Kin Leong, Luca Peluso | 2024-11-19 |
| 12136583 | Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangement | — | 2024-11-05 |
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Petteri Palm +1 more | 2024-09-17 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |