Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Swee Kah Lee +2 more | 2024-12-24 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Jayaganasan Narayanasamy +1 more | 2024-05-14 |