Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Thorsten Meyer, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee +2 more | 2024-12-24 |