Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee +1 more | 2024-05-14 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Angel Enverga, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |