Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068213 | Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof | Thai Kee Gan, Ralf Otremba | 2024-08-20 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chii Shang Hong, Chee Ming Lam, Subaramaniym Senivasan | 2024-02-20 |