Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159829 | Semiconductor package with non-uniformly distributed vias | Robert Fehler, Petteri Palm | 2024-12-03 |
| 12094807 | Stacked transistor chip package with source coupling | Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |
| 12009290 | Semiconductor module having a multi-branch switch node connector | Robert Fehler, Angela Kessler, Gerhard Noebauer, Petteri Palm | 2024-06-11 |
| 11978692 | Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module | Josef Hoeglauer, Gerhard Noebauer, Hao Zhuang | 2024-05-07 |
| 11973071 | Semiconductor module | Gerhard Noebauer | 2024-04-30 |
| 11935874 | Circuitry and method of forming a circuitry | Robert Fehler | 2024-03-19 |