Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087740 | Method of forming a semiconductor module | Angela Kessler, Gerhard Noebauer | 2024-09-10 |
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Kok Yau Chua, Chiah Chin Lim, Mei Qi Tay | 2024-07-02 |
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2024-05-28 |
| 11978692 | Semiconductor package, semiconductor module and methods for manufacturing a semiconductor package and a semiconductor module | Sergey Yuferev, Gerhard Noebauer, Hao Zhuang | 2024-05-07 |