Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Kok Yau Chua, Josef Hoeglauer, Mei Qi Tay | 2024-07-02 |
CL
Chiah Chin Lim
Overall (2024): #509,886 of 561,600Top 95%
1
Patents 2024