Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027436 | Package with clip having through hole accommodating component-related structure | Angela Kessler, Kok Yau Chua, Josef Hoeglauer, Chiah Chin Lim | 2024-07-02 |
MT
Mei Qi Tay
Overall (2024): #346,577 of 561,600Top 65%
1
Patents 2024