Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12150236 | Voltage regulator module with inductor-cooled power stage | Gerald Deboy, Kok Yau Chua, Kennith Kin Leong, Chee Yang Ng, Luca Peluso | 2024-11-19 |
| 12131988 | Semiconductor package and passive element with interposer | Robert Carroll, Robert Fehler | 2024-10-29 |
| 12087740 | Method of forming a semiconductor module | Josef Hoeglauer, Gerhard Noebauer | 2024-09-10 |
| 12033909 | Die package and method of manufacturing a die package | Petteri Palm | 2024-07-09 |
| 12027436 | Package with clip having through hole accommodating component-related structure | Kok Yau Chua, Josef Hoeglauer, Chiah Chin Lim, Mei Qi Tay | 2024-07-02 |
| 12009290 | Semiconductor module having a multi-branch switch node connector | Sergey Yuferev, Robert Fehler, Gerhard Noebauer, Petteri Palm | 2024-06-11 |