Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Chee Yang Ng, Petteri Palm +1 more | 2024-09-17 |
| 11903132 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Petteri Palm, Martin Benisek, Liu Chen, Frank Daeche | 2024-02-13 |