MS

Michael Stadler

Infineon Technologies Ag: 5 patents #21 of 819Top 3%
XE Xendee: 1 patents #1 of 4Top 25%
📍 Munich, PA: #1 of 6 inventorsTop 20%
Overall (2024): #23,154 of 561,600Top 5%
6
Patents 2024

Issued Patents 2024

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12132017 Method of soldering a semiconductor chip to a chip carrier Paul Armand Asentista Calo 2024-10-29
11990405 Semiconductor arrangement and method for producing a semiconductor arrangement 2024-05-21
11966989 Robust and fast design of microgrids, der systems, and other energy systems using staged hybrid investment planning Zachary K. Pecenak, Patrick James Mathiesen, Kelsey T. Fahy 2024-04-23
11901257 Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package Thomas Stoek 2024-02-13
11869830 Semiconductor package and clip with a die attach Thomas Bemmerl 2024-01-09
11869865 Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof Thomas Bemmerl, Chooi Mei Chong, Edward Myers 2024-01-09