Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046540 | Leadframe package with adjustable clip | Christian Feuerbaum | 2024-07-23 |
| 11901257 | Semiconductor package, metal sheet for use in a semiconductor package, and method for producing a semiconductor package | Michael Stadler | 2024-02-13 |
| 11862541 | Molded semiconductor package having a negative standoff | Dirk Ahlers, Stefan Macheiner | 2024-01-02 |