Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Bernd Waidhas, Georg Seidemann, Thomas Wagner | 2024-10-22 |
| 11984246 | Vertical inductor for WLCSP | Thorsten Meyer, Gerhard Knoblinger | 2024-05-14 |
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Marc Dittes +1 more | 2024-04-09 |