Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Andreas Wolter, Georg Seidemann, Thomas Wagner | 2024-10-22 |
| 12080655 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Gianni SIGNORINI, Georg Seidemann | 2024-09-03 |
| 12057364 | Package formation methods including coupling a molded routing layer to an integrated routing layer | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2024-08-06 |
| 12057411 | Stress relief die implementation | Stephan Stoeckl, Wolfgang Molzer, Georg Seidemann | 2024-08-06 |
| 11955395 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2024-04-09 |
| 11877403 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Sonja Koller | 2024-01-16 |