Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057364 | Package formation methods including coupling a molded routing layer to an integrated routing layer | Lizabeth Keser, Thomas Wagner, Bernd Waidhas | 2024-08-06 |
| 11955395 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Wagner | 2024-04-09 |