Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Bernd Waidhas, Andreas Wolter, Georg Seidemann | 2024-10-22 |
| 12057364 | Package formation methods including coupling a molded routing layer to an integrated routing layer | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2024-08-06 |
| 11990408 | WLCSP reliability improvement for package edges including package shielding | Jan Proschwitz | 2024-05-21 |
| 11955395 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Ort | 2024-04-09 |