Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Bernd Waidhas, Andreas Wolter, Thomas Wagner | 2024-10-22 |
| 12080655 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Gianni SIGNORINI, Bernd Waidhas | 2024-09-03 |
| 12057411 | Stress relief die implementation | Stephan Stoeckl, Wolfgang Molzer, Bernd Waidhas | 2024-08-06 |
| 11955462 | Package stacking using chip to wafer bonding | Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |
| 11877403 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Sonja Koller, Bernd Waidhas | 2024-01-16 |