Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080655 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Georg Seidemann, Bernd Waidhas | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080655 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Georg Seidemann, Bernd Waidhas | 2024-09-03 |