Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |