Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002724 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Martin Mayer, Ivan Nikitin | 2024-06-04 |
| 11978700 | Power semiconductor module arrangement | Peter Kanschat | 2024-05-07 |
| 11955450 | Method for producing a semiconductor arrangement | — | 2024-04-09 |