Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107026 | Circuit arrangement with a thermal interface | Philip Michael AMOS, Walter Hartner | 2024-10-01 |
| 12002724 | Power module with metal substrate | Wu Hu Li, Olaf Hohlfeld, Martin Mayer, Ivan Nikitin | 2024-06-04 |