Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Edward Fuergut, Ralf Otremba | 2024-03-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Edward Fuergut, Ralf Otremba | 2024-03-12 |