Issued Patents 2024
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136623 | Multi-device semiconductor chip with electrical access to devices at either side | Edward Fuergut, Peter Friedrichs, Ralf Otremba | 2024-11-05 |
| 12107141 | Semiconductor device having a silicon carbide drift zone over a silicon carbide field stop zone | Jens Peter Konrath, Andre Rainer Stegner, Helmut Strack | 2024-10-01 |
| 12107130 | Semiconductor device having semiconductor device elements in a semiconductor layer | Ingo Muri, Johannes Baumgartl, Oliver Hellmund, Jacob Tillmann Ludwig, Iris Moder +2 more | 2024-10-01 |
| 12107128 | Method of producing a semiconductor device having a ferroelectric gate stack | Saurabh Roy, Thomas Aichinger | 2024-10-01 |
| 12057316 | Semiconductor device fabricated using channeling implant | Moriz Jelinek, Paul Ellinghaus, Axel Koenig, Caspar Leendertz, Werner Schustereder | 2024-08-06 |
| 12027591 | Method for forming a semiconductor device and a semiconductor device | Roland Rupp | 2024-07-02 |
| 11949006 | Power semiconductor device with p-contact and doped insulation blocks defining contact holes | Markus Beninger-Bina, Matteo Dainese, Ingo Dirnstorfer, Erich Griebl, Johannes Georg Laven +1 more | 2024-04-02 |
| 11929397 | Semiconductor device including trench structure and manufacturing method | Thomas Basler, Caspar Leendertz | 2024-03-12 |
| 11908694 | Ion beam implantation method and semiconductor device | Moriz Jelinek, Michael Hell, Caspar Leendertz, Kristijan Luka MLETSCHNIG | 2024-02-20 |
| 11888024 | Method of forming a semiconductor device | Reinhard Ploss | 2024-01-30 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert +1 more | 2024-01-30 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez | 2024-01-23 |
| 11881406 | Method of manufacturing a semiconductor device and semiconductor wafer | Francisco Javier Santos Rodriguez, Roland Rupp | 2024-01-23 |