Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027591 | Method for forming a semiconductor device and a semiconductor device | Hans-Joachim Schulze | 2024-07-02 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert +1 more | 2024-01-30 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |
| 11881406 | Method of manufacturing a semiconductor device and semiconductor wafer | Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |
| 11869840 | Silicon carbide device and method for forming a silicon carbide device | Ralf Siemieniec, Dethard Peters | 2024-01-09 |