Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060266 | Method with mechanical dicing process for producing MEMS components | Andre Brockmeier, Markus Bergmeister, Daniel Pieber, Sokratis Sgouridis | 2024-08-13 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |