Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060266 | Method with mechanical dicing process for producing MEMS components | Markus Bergmeister, Bernhard Goller, Daniel Pieber, Sokratis Sgouridis | 2024-08-13 |
| 11990520 | Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures | Guenter Denifl, Ronny Kern, Michael Knabl, Matteo Piccin, Francisco Javier Santos Rodriguez | 2024-05-21 |
| 11939216 | Method with stealth dicing process for fabricating MEMS semiconductor chips | Stephan Helbig, Adolf Koller | 2024-03-26 |