Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2024-07-09 |
| 12034066 | Power semiconductor device having a barrier region | Antonio Vellei, Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +1 more | 2024-07-09 |
| 11990520 | Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structures | Andre Brockmeier, Guenter Denifl, Ronny Kern, Michael Knabl, Matteo Piccin | 2024-05-21 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2024-01-30 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Hans-Joachim Schulze | 2024-01-23 |
| 11881406 | Method of manufacturing a semiconductor device and semiconductor wafer | Roland Rupp, Hans-Joachim Schulze | 2024-01-23 |