Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer +6 more | 2024-07-09 |
| 12034066 | Power semiconductor device having a barrier region | Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven, Alexander Philippou +1 more | 2024-07-09 |