Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Wolfgang Lehnert, Evelyn Napetschnig, Michael Rogalli | 2024-07-16 |
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Joachim Mahler, Michael Bauer, Jochen Dangelmaier, Reimund Engl, Frank Hille +6 more | 2024-07-09 |