Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Evelyn Napetschnig | 2024-07-16 |
MR
Michael Rogalli
Overall (2024): #338,595 of 561,600Top 65%
1
Patents 2024