Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Oliver Humbel, Thomas Rupp +2 more | 2024-12-31 |
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Wolfgang Lehnert, Michael Rogalli | 2024-07-16 |