Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183696 | Semiconductor device including bonding pad metal layer structure | Evelyn Napetschnig, Jens Brandenburg, Christoffer Erbert, Joachim Hirschler, Thomas Rupp +2 more | 2024-12-31 |