Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040288 | Chip package and method of forming a chip package | Harry Sax, Johann Gatterbauer, Evelyn Napetschnig, Michael Rogalli | 2024-07-16 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Roland Rupp +1 more | 2024-01-30 |