Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2024-01-30 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |