Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2024-01-30 |