Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033972 | Chip package, method of forming a chip package and method of forming an electrical contact | Michael Bauer, Jochen Dangelmaier, Reimund Engl, Johann Gatterbauer, Frank Hille +6 more | 2024-07-09 |