Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Lee Shuang Wang | 2024-09-17 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Thai Kee Gan, Mark Pavier, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Lee Shuang Wang | 2024-01-16 |