Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068274 | Semiconductor die being connected with a clip and a wire which is partially disposed under the clip | — | 2024-08-20 |
| 12063474 | Methods of environmental protection for silicon MEMS structures in cavity packages | Paul Westmarland, Bernd Goller, Scott Palmer | 2024-08-13 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Thai Kee Gan, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |