Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080625 | Semiconductor package with releasable isolation layer protection | Yee Beng Daryl Yeow, Chii Shang Hong, Azlina Kassim, Hui Kin Lit | 2024-09-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080625 | Semiconductor package with releasable isolation layer protection | Yee Beng Daryl Yeow, Chii Shang Hong, Azlina Kassim, Hui Kin Lit | 2024-09-03 |