Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810859 | Multi-layered adhesion promotion films | Srinivas V. Pietambaram, Cemil Geyik, Kemal Aygun | 2023-11-07 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11791269 | Electrical interconnect bridge | Srinivas V. Pietambaram | 2023-10-17 |
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo | 2023-09-26 |
| 11756890 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2023-09-12 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Marcel Wall | 2023-07-04 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11658055 | Customizable release layers to enable low warpage architectures for advanced packaging applications | Suddhasattwa Nad | 2023-05-23 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Gang Duan, Edvin Cetegen, Baris Bicen | 2023-05-09 |
| 11600563 | Molded embedded bridge including routing layers for enhanced EMIB applications | Srinivas V. Pietambaram | 2023-03-07 |