Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854932 | Package wrap-around heat spreader | Feras Eid, Chandra Mohan Jha | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11830783 | Embedded substrate heat sink for bottom side cooling | Aastha Uppal, Divya Mani | 2023-11-28 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Nicholas Neal, Jae Whan Kim, Ravindranath V. Mahajan | 2023-10-31 |
| 11721607 | Integrated circuit assemblies having metal foam structures | Aastha Uppal | 2023-08-08 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Kelly Lofgreen, Weihua Tang, Aastha Uppal | 2023-06-13 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu, Liwei Wang | 2023-06-06 |
| 11664294 | Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies | Aastha Uppal, Weihua Tang, Minseok Ha | 2023-05-30 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |