Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854932 | Package wrap-around heat spreader | Feras Eid, Je-Young Chang | 2023-12-26 |
| 11837519 | Heatsink cutout and insulating through silicon vias to cut thermal cross-talk | Zhimin Wan, Chia-Pin Chiu | 2023-12-05 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Ravindranath V. Mahajan, Kelly Lofgreen, Weihua Tang | 2023-09-12 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Jimin Yao | 2023-08-22 |
| 11705417 | Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level | Prasad Ramanathan, Xavier Francois Brun, Jimmin Yao, Mark R. Allen | 2023-07-18 |
| 11694942 | Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management | Kelly Lofgreen, Krishna Vasanth Valavala | 2023-07-04 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Liwei Wang | 2023-06-06 |
| 11664293 | Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios | Krishna Vasanth Valavala, Ravindranath V. Mahajan | 2023-05-30 |
| 11658095 | Bump integrated thermoelectric cooler | Kelly Lofgreen, Krishna Vasanth Valavala | 2023-05-23 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Zhimin Wan | 2023-04-11 |
| 11587843 | Thermal bump networks for integrated circuit device assemblies | Prasad Ramanathan, Nicholas Neal | 2023-02-21 |