Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804424 | Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clip | Chii Shang Hong, Jo Ean Joanna Chye, Teck Sim Lee, Hui Kin Lit, Ke Yan Tean +2 more | 2023-10-31 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Eung San Cho, Josef Hoeglauer, Fabian Schnoy | 2023-10-03 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Irmgard Escher-Poeppel, Martin Gruber | 2023-08-01 |
| 11688670 | Semiconductor package and method for fabricating a semiconductor package | Paul Frank, Alexander Heinrich, Alexandra Ludsteck-Pechloff, Daniel Pedone | 2023-06-27 |
| 11676881 | Semiconductor package, semiconductor assembly and method for fabricating a semiconductor package | Teck Sim Lee, Klaus Schiess, Xaver Schloegel, Lee Shuang Wang, Mohd Hasrul Zulkifli | 2023-06-13 |
| 11605577 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2023-03-14 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2023-03-07 |