Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Ralf Otremba, Martin Gruber | 2023-08-01 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |