Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728250 | Semiconductor package with connection lug | Martin Gruber, Herbert Hopfgartner, Bernd Schmoelzer | 2023-08-15 |
| 11721616 | Semiconductor package with signal distribution element | Stephan Voss, Martin Gruber, Andreas Huerner, Anton Mauder | 2023-08-08 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Ralf Otremba, Irmgard Escher-Poeppel, Martin Gruber | 2023-08-01 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Irmgard Escher-Poeppel, Martin Gruber, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |
| 11646258 | Electronic devices including electrically insulated load electrodes | Thomas Basler, Reinhold Bayerer, Ivan Nikitin | 2023-05-09 |