Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728250 | Semiconductor package with connection lug | Edward Fuergut, Herbert Hopfgartner, Bernd Schmoelzer | 2023-08-15 |
| 11721616 | Semiconductor package with signal distribution element | Stephan Voss, Edward Fuergut, Andreas Huerner, Anton Mauder | 2023-08-08 |
| 11715719 | Semiconductor package and method of forming a semiconductor package | Edward Fuergut, Ralf Otremba, Irmgard Escher-Poeppel | 2023-08-01 |
| 11710684 | Package with separate substrate sections | Frank Singer, Thorsten Meyer, Thorsten Scharf, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11688713 | Additive manufacturing of a frontside or backside interconnect of a semiconductor die | Edward Fuergut, Irmgard Escher-Poeppel, Ivan Nikitin, Hans-Joachim Schulze | 2023-06-27 |
| 11600558 | Plurality of transistor packages with exposed source and drain contacts mounted on a carrier | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Elvir Kahrimanovic | 2023-03-07 |