Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11710684 | Package with separate substrate sections | Frank Singer, Martin Gruber, Thorsten Scharf, Peter Strobel, Stefan Woetzel | 2023-07-25 |
| 11652084 | Flat lead package formation method | Gerald Ofner, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
| 11552048 | Semiconductor device including an electrical contact with a metal layer arranged thereon | Oliver Hellmund, Barbara Eichinger, Ingo Muri | 2023-01-10 |