SB

Stephan Bradl

Infineon Technologies Ag: 1 patents #321 of 942Top 35%
📍 Regensburg, DE: #55 of 197 inventorsTop 30%
Overall (2023): #247,022 of 537,848Top 50%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11652084 Flat lead package formation method Thorsten Meyer, Gerald Ofner, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more 2023-05-16